Daiwa Fine Chemicals Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 546
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 398
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 134
 
  
 
C25C PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR 118

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7938948 Silver and silver alloy plating bathSep 03, 09May 10, 11[C23C, C25D]
7628903 Silver and silver alloy plating bathMay 02, 00Dec 08, 09[C23C, C25D]
7166152 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the methodAug 07, 03Jan 23, 07[C23C]
7056448 Method for forming circuit patternMay 20, 03Jun 06, 06[C23F]
6607653 Plating bath and process for depositing alloy containing tin and copperSep 22, 00Aug 19, 03[C25D]
6338787 Redox system electroless plating methodApr 05, 00Jan 15, 02[C25C]
6235093 Aqueous solutions for obtaining noble metals by chemical reductive depositionJun 28, 99May 22, 01[C23C]
6183545 Aqueous solutions for obtaining metals by reductive depositionJun 28, 99Feb 06, 01[C23C, C25D]
5651873 Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surfaceJun 26, 95Jul 29, 97[C25D]
5618404 Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating useMay 16, 95Apr 08, 97[C25B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0159,453 METHOD FOR SILVER PLATINGAbandonedJul 11, 08Jun 25, 09[C25D]
2007/0284,258 Method For Silver PlatingAbandonedJun 07, 07Dec 13, 07[C25D]
2006/0113,006 Tin-containing plating bathAbandonedJan 22, 04Jun 01, 06[C23C]
6852210 Plating method and plating bath precursor used thereforExpiredJan 07, 02Feb 08, 05[C25D]
2003/0150,743 Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bathAbandonedSep 20, 02Aug 14, 03[C25D, C09D]
4673470 Tin, lead, or tin-lead alloy plating bathExpiredFeb 21, 86Jun 16, 87[C25D]
4555314 Tin-lead alloy plating bathExpiredSep 10, 84Nov 26, 85[C25D]
4459185 Tin, lead, and tin-lead alloy plating bathsExpiredSep 16, 83Jul 10, 84[C25D]

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